Umicore Sealing 692 is a post-treatment process to reliably protect technical precious metal surfaces. By a simple dipping process a thin, transparent layer is applied, which prevents the tarnishing of e.g. a silver surface and protects against corrosive environmental influences. The solderability is not affected and the contact resistance against an untreated surface is hardly affected. The tarnish protection process is particularly suitable for sliding and plug contacts, as the mating and pulling forces during the mating process are significantly reduced. Umicore Sealing 692 also impresses with a significant reduction in the coefficient of friction. It contains no environmentally harmful components such as solvents, CFCs, CHCs, hydrocarbons or chromium compounds.
Advantages
• Reduces insertion and withdrawal forces
• Very short treatment times, therefore suitable for reelto- reel plating
• Protects against tarnishing, discoloration and corrosion
• Easy to use
• Free of components such as solvents, CFCs, CHCs, HCFCs and chromium
• No influence on colour or gloss of the final layer
Applications
• Connectors (also in the automotive sector)
• Lead frames
• Smartcards
ELECTROLYTE CHARACTERISTICS |
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| COATING CHARACTERISTICS |
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Electrolyte type | Aqueous, metalfree | Colour | Transparent | |
pH value | Weakly acidic to | Brightness | No influence | |
Operating temperature | 55 (53 - 57) °C | Coefficient of friction | Significantly reduced | |
Immersion time | 30 (10 - 120) s | Sliding properties | Improved | |
| Solderability | No influence | |||
| Contact resistance | < 10 mΩ | |||
Bondability | Protected parts remain bondable |
