PALLUNA® ACF-200


PALLADIUM - NICKEL ELECTROLYTE
PALLUNA® ACF-200 is operated without ammonia, thus avoiding offensive smells caused by pungent ammonia gases. Since no chloride is used in the electrolyte, the lifetime of the anodes is considerably longer and equipment corrosion is strongly reduced. By means of continuous active carbon purification, interfering organic decomposition products can be effectively removed from the electrolyte. Depending on the operating conditions, the electrolyte deposits alloy coatings containing approx. 80 % of palladium. The palladium-nickel layers are hard, resistant to wear and corrosion, they are characterized by good ductility and low internal stress. In combination with flash gold, bondabilities comparable to those of soft gold surfaces can be reached. PALLUNA® ACF-200 has the cost advantage on its side: With contact properties similar to those of hard gold, palladiumnickel is the clearly less expensive alternative.


Advantages
• Palladium-nickel electrolyte free from ammonium and chloride for 
   printed circuit board applications
• No offensive smell caused by ammonia gas
• Longer lifetime of anodes
• Reduced equipment corrosion
• Ductile and crack-free coatings
• Excellent abrasion resistance
• Constant alloy composition of the coatings
• Solder- and bondability, especially with goldflash


Applications
• Printed circuit boards
• Contacts on plug-in cards
• Smartcards


 

ELECTROLYTE CHARACTERISTICS

 

 

COATING CHARACTERISTICS

 

Electrolyte type

Free from ammonia
and chloride

 

Coating

Palladium-Nickel

Metal content

8 g/l Pd, 7 g/l Ni

 

Alloy composition

80 wt.% Pd
20 wt.% Ni

pH value

5.2

 

Colour of deposit

White

Operating temperature

62 °C

 

Brightness Bright
Current density range Up to 4 A/dm²

 

Hardness of deposit
HV 0.015 (Vickers)
approx. values
530 HV
Plating speed 0.39 μm/min
at 2 A/dm²

 

Coating density 10.8 g/cm³
Anode material MMO (type PLATINODE    187 SO)

 

Elongation   Approx. 5 %
   

 

Bendability (5 mm mandrel) 2 μm crack-free
   

 

Solderability   Good






     

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