Pure palladium electrolyte with excellent bonding and solderability
PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used especially where excellent bondability and solderability are required.
The electrolyte has already been used for years in semiconductor technology and is mainly used in selective high-speed deposition. It is particularly suitable for systems with immersion cells, belt cells, brush cells, jet and spot systems.
Electrolyte characteristics
Electrolyte type
weakly ammoniacal
Metal content
3 (2.5 - 7) g/l Pd
pH value
8.0 (7.5 - 8.4)
Operating temperature
55 (50 - 60) °C
Current density range
1 - 2 A/dm²
Plating speed
ca. 0.25 μm/min bei 1 A/dm² ca. 0.50 μm/min bei 2 A/dm²
Anode material
PLATINODE® 167
Coating characteristics
Coating
Pure palladium
Purity
99.9 wt.% Pd
Colour of deposit
white
Brightness
matt
Max. coating thickness
approx. 0.3 μm
Density of the coating
approx. 12 g/cm³
Advantages
Excellent bonding and solderability
High deposition rate
Simple electrolyte feed
For continuous lines and rack plating
Applications
Lead frames
