GOLD ELECTROLYTE
Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost saving potential by reducing dragout gold volume. This process also has excellent solder joint characteristics due to its lower corrosion attack on electroless nickel. The electrolyte needs one concentrate for make up and an additional component for replenishment.
Advantages
• Easy maintainance due to displacement process
• Very low gold content
• Lemon-yellow appearance
• Minimized corrosion attack on electroless nickel
Applications
• ENIG plating on PCB and ceramic subtrates used for
• Consumer electronics
• Automotive industry
• Industrial electronics
• Telecommunications
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ELECTROLYTE CHARACTERISTICS |
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COATING CHARACTERISTICS |
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Electrolyte type |
Displacement type |
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Coating |
Fine gold |
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Metal content |
0.4 (0.2 - 0.6) g/l Au |
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Purity |
99,9 wt.% Au |
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pH value |
7.2 (7.0 - 7.4) |
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Colour of deposit |
Lemon yellow |
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Operating temperature |
80 (75 - 85) °C |
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| Plating speed | 0.065 μm/10 min at 80°C |
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