Additives for acid copper via filling
Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating technology for blind via filling and simultaneous through-hole plating. The blind via hole filling characteristics for holes with diameters less than 150 μm are excellent. Thru-cup EVF-N works with three additives which can be easily controlled by CVS. Via filling performance is not influenced by electrolyte ageing. The plated copper film has an excellent thickness distribution.
Application Features
Thermal management enhancement
Higher interconnect density in HDI PCB
Long term reliability of the assembly and packaging operation
Electrolyte characteristics
Electrolyte type Acidic
Metal content 200 g/l CuSO4-5H2O
pH value (not monitored)
Operating temperature 25 (22 - 27) °C
Current density range 1.0 (0.5 - 2.5) A/dm²
Anode material Soluble / Insoluble
Advantages
Excellent blind via hole filling characteristics
Suitable for panel and pattern plating with simultaneous through-hole plating
Long electrolyte lifetime
Excellent thickness distribution of the plated copper film
Concentrations of all additives can be analysed by cyclic voltammetry (CVS)
Applications
IT products
Consumer electronics
Automotive applications
