Pure palladium electrolyte with excellent bonding and solderability
PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used especially where excellent bondability and solderability are required.

The electrolyte has already been used for years in semiconductor technology and is mainly used in selective high-speed deposition. It is particularly suitable for systems with immersion cells, belt cells, brush cells, jet and spot systems.

Electrolyte characteristics

Electrolyte type weakly ammoniacal
Metal content 3 (2.5 - 7) g/l Pd
pH value 8.0 (7.5 - 8.4)
Operating temperature 55 (50 - 60) °C
Current density range 1 - 2 A/dm²
Plating speed ca. 0.25 μm/min bei 1 A/dm² ca. 0.50 μm/min bei 2 A/dm²
Anode material PLATINODE® 167


Coating characteristics

Coating Pure palladium
Purity 99.9 wt.% Pd
Colour of deposit white
Brightness matt
Max. coating thickness approx. 0.3 μm
Density of the coating approx. 12 g/cm³


Advantages
Excellent bonding and solderability
High deposition rate
Simple electrolyte feed
For continuous lines and rack plating
 

Applications
Lead frames