Electroless palladium and semi-autocatalytic gold plating
Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.
Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations.
Advantages
Nickel free coating
Thin and very uniform electroless deposition
Suitable for (ultra) fine pitch layouts
Ductile film compatible for flex PCB applications
Dense and homogenous gold protection layer up to 0.3 μm feasible
High solderjoint reliability (SJR) due to low void formation
Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability
Applications
Flexboard PCB (FPC)
Multi-functional assembly
Fine pattern PCB design
