Chloride-free palladium catalyst for printed circuit boards and ceramic substrates. High seed density, selective seeding of copper. Simple bath maintenance with long bath life. For NIRUNA® Process.
| Specified content / bath makeup per 1 litre | pH-value | Current density A/dm2 | Time of exposure | Temperature °C | Electrode material |
| Pd 10 mg (5-15 mg) Makeup Concentrate 100 ml (50-150 ml) |
≤1 | - | 30-180 sec | 25 (20-40) | - |
