Take Advanced Packaging to a completely new level
Umicore´s business unit Electroplating have partnered with SHINHAO Materials to provide innovative patented additives* for copper electroplating into the advanced packaging industry.
IntraCu®* as a modular Copper electroplating additive system embodies an integral part of our joint product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry.
IntraCu®* additives can be seen as a POR replacement for Microbumps in IC packages, RDL in wafer level packaging and Pillar in flip-chip packaging.
Advantages
Bamboo-like structure
Matte Cu, Ra < 0.2 μm
Flat topography
Stable tensile strength
Resistant to grain growth
Resistant to etching
Bright Cu, Ra < 0.03 μm
±50% process window for Cu pillar and RDL
Total in-film organics < 11 ppm
Excellent KV-less performance
Applications
Fine line RDL (< 2 μm)
Cu-to-Cu direct bonding
2-in-1 bright Cu (Cu pillar and RDL)
2-in-1 with KV-less requirement
