Chloride-free palladium catalyst for printed circuit boards and ceramic substrates. High seed density, selective seeding of copper. Simple bath maintenance with long bath life. For NIRUNA® Process. \r\n \r\n \r\n \r\n Specified content / bath makeup per 1 litre \r\n pH-value \r\n Current density A/dm2 \r\n Time of exposure \r\n Temperature °C \r\n Electrode material \r\n \r\n \r\n Pd 10 mg (5-15 mg) Makeup Concentrate 100 ml (50-150 ml) \r\n ≤1 \r\n - \r\n 30-180 sec \r\n 25 (20-40) \r\n - \r\n \r\n \r\n
